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DiTEC Polishing Compound - Fine Cut - 32oz

DiTEC Polishing Compound - Fine Cut - 32oz
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Polishing Compound - Fine Cut - 32oz

This advanced fine cut, anti-hologram polish removes polishing haze and swirl marks for a 100% hologram-free finish. Featuring next-gen, self-grinding alumina abrasives, it's safe for all paint types - fresh, cured, and scratch-resistant. Water-based, silicone- and solvent-free.

Features:

  • Effectively removes holograms
  • Free of solvents and silicone
  • Appearance: Cream/Paste
  • Solubility: N/A
  • pH: 8

Use & Application:

For the DiTEC Fine Cut Compound, we recommend using the DiTEC Red Trapez foam polishing pad.

Application: Apply a sufficient amount of the polishing compound to the polishing pad or to the painted surface. Spread the compound at a low speed (about 1000 rpm) on the defect and at about 1600 rpm using moderate pressure.

WARNING: This product can expose you to chemicals including Di(2-ethylhexyl)phthalate (DEHP), which is known to the State of California to cause cancer and birth defects or other reproductive harm. For more information, go to www.P65Warnings.ca.gov.
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Shipping Restrictions
  • This item cannot be shipped to PO Boxes.
  • This item can be shipped only within the U.S.


  • UPC: 850019168440 
  • Mfr's Part #: PC-CMPD-FCO2